2018 ACENS
Asian Conference on Engineering and Natural Sciences

February 6-8, 2018   Osaka, Japan


Abstract Submission Deadline on October 19, 2017

Asian Conference on Engineering and Natural Sciences (ACENS) is an international platform for scholars, researchers and practitioners to discuss interdisciplinary research and practices in the fields of engineering, natural sciences and beyond.


2018 ACENS will take place from February 6-8, 2018 in Osaka, Japan. Prospective authors are invited to submit original research abstracts or full papers which were not, are not and have not been submitted/published/under consideration in other conferences and journals.

Welcome Message

Dear Delegates:

I would like to welcome you to Osaka, Japan for the Asian Conference on Engineering and Natural Sciences (ACENS) of 2018, sponsored by the Higher Education Forum (HEF) at the International House in Osaka, which is affectionately known as iHOUSE. The venue truly represents the foundation’s desire to strengthen international friendships from citizens of the world and Japan....

Stacey Vye

Stacey Vye

International Liaison for the ISSSM Osaka 2018

Associate Professor at Saitama University, Japan

A Doctoral Candidate at the University of Southern California, Rossier School of Education, Organizational Change and Leadership


Topics

Natural Sciences

Astronomy

Biology

Chemistry

Physics

Earth Sciences

Engineering

Aeronautics & Aerospace Engineering

Biological Engineering

Chemical Engineering

Civil Engineering

Computer Engineering and Technology

Electrical and Electronic Engineering

Environmental Engineering

Information Engineering and Technology

Materials Science and Engineering

Mechanical Engineering and Technology

Power & Energy Engineering

>> more topics

Paper Format  Submission System


Contact
ACENS Secretariat

Email: acens@acens-conf.org

Sign up Submit

Important Dates

Abstract Submission
October 19, 2017

November 19, 2017

Notification of Acceptance 
October 26, 2017
Final Abstract & Full Paper Submission Deadline 
November 30, 2017
Regular Registration Deadline 
December 14, 2017
Conference Date 
February 6-8, 2018